Developer Home Contents Search Feedback Support Intel(r)


Emulator/Test Flex Probes

Alptex Inc.


Architecture:
Type :
Last Update:

Flash Memory Components Boot Block
Test Accessories (Flash)
4/23/98 12:00:17 PM

Vendor Information


Tool Description:

ALPTEX FlexProbes are a solution to a common development lab
problem...electrically connecting to a package land-pad pattern, or "target". Many "stacking adaptor" and ribbon cable interconnects have been available for older package "targets" such as DIP and, more recently, PLCC. However, prior to the creation of ALPTEX FlexProbes, none were available to support the newer packages...TSOP, SSOP, PSOP and the &#181;BGA* package.<BR>
The target end of the streamlined FlexProbe connects either to a
socket or by reflow soldering to the land-pad pattern. The interface connector at the opposite end of the FlexProbe can then be attached to your memory emulator or test/trace apparatus. Because FlexProbes are designed around JEDEC package specifications, intrusion in the target area is minimized, permitting denser component layout on development boards.<BR>
ALPTEX FlexProbes are often bundled with ROM or Intel&#174; Flash memory
emulators. They can also be shipped directly from our factory...most often in less than 24 hours.<BR> &#32;
*Other brands and names are the property of their respective owners.

Tool Features:

  • A unique solution which enables the user to connect to popular package footprints.

  • The most flexible "target" interconnect available...minimizes strain on the target pads.

  • Eliminates the need to alter the P. C. Board between development and production phases.

  • Enables connection to any or all pins of the target via a rugged interface connector.

  • Extremely low profile minimizes clutter at the target site.

  • Compact length virtually eliminates crosstalk/EMI problems.

  • Extenders with embedded groundplane available if additional length is required.

  • Support for TSOP, SSOP, PSOP, PLCC, and &#181

  • BGA* packages.

  • Available in "Socket" or "Direct Solder" types.

  • High performance Kapton insulation.

    • File Attachments:

    EXTENDFP.PDF - Extender connector product brief
    MBGA_FP.PDF - &#181
    PLCC_FP.PDF - BGA* Package FlexProbe
    PSOP_FP.PDF - PLCC FlexProbe
    SSOP_FP.PDF - PSOP FlexProbe
    TSOP_FP.PDF - SSOP FlexProbe
    TSOP_FP.PDF - TSOP FlexProbe

    Supported Device Detail Matrix:

    		Part & Package

    		28F001BX - PLCC-32 ld
    28F001BX - TSOP-32 ld
    28F002BC - PSOP-44 ld
    28F002BC - TSOP-40 ld
    28F002BX/BL - TSOP-40 ld
    28F004BX/BL - TSOP-40 ld
    28F200BX/BL - PSOP-44 ld
    28F200BX/BL - TSOP-56 ld
    28F400BX/BL - PSOP-44 ld
    28F400BX/BL - TSOP-56 ld


    Vendor Information:


    Alptex Inc.

    P.O. Box 476
    Orwell , OH 44076
    USA
    (440) 437-5570

    Email : tech@alptex.com
    Fax : (440) 437-5571
    URL : http://www.alptex.com

    Contact the vendor above for the latest Distributor information



    * Legal Information © 1998 Intel Corporation